AS618
The AS618 is the AS-family chip that steps in where a module has to be thin and the power budget is thin too — a companion controller that runs the in-house fingerprint algorithm on the same firmware dialect as the flagship part. Built for slim semiconductor module designs, from low-profile fingerprint locks to school-ID peripherals.
Key specifications
| Function | Fingerprint enrollment, 1:1 and 1:N handling as a module companion controller |
|---|---|
| Algorithm | In-house DSP-based matching engine, same SDK dialect as AS608 for one firmware tree |
| Design goal | Slim-form builds — low total BOM height for board-in-door and flex-stack modules |
| Sensor interface | BS-series capacitive fingerprint arrays (BS807 / BS817 / BS870A / BS900T class) |
| Host interfaces | SPI, UART, USB — SDK examples for all three |
| Target applications | Slim fingerprint modules, low-cost enrollment peripherals, compact module builds |
| Marking | AS618 (module companion, surface-mount) |
Full specification
| Parameter | Value | Note |
|---|---|---|
| Product family | AS-series fingerprint secure SoC | Module-side member |
| Algorithm engine | DSP-based, in-house | 400+ registered IP across group |
| Template capacity | Typical module platform: 100–200+ templates | Configurable via SDK |
| Match latency | Sub-second class | SDK-tuned per platform |
| Interfaces | SPI / UART / USB | All documented in SDK |
| Sensor support | BS-series capacitive arrays | 508 DPI class |
| Power profile | Low-power oriented for managed enclosures | Battery-tolerant reference designs in SDK |
| Operating environment | Industrial temperature-class design | See AM-series module for −40~85°C fixture data |
| Packaging | Surface-mount, tape/reel on request | ESD-safe handling documented |
Board-level values vary with sensor and clock config — a schematic check by FAE takes under 48h.
Thin geometry is the gate; power is the wall.
Once a lock vendor moves from a chunky module to a 6-mm-class fingerprint stack, the controller board is usually what breaks the profile. The AS618 exists so that thin is a design decision, not a compromise:
- One-die integration — sensor readout, algorithm and host protocol on a companion controller, which cuts the module to two boards or one flex instead of three.
- Same firmware dialect as AS608 — a module team that already shipped on the flagship part reuses its template format, command set and test scripts almost unchanged.
- Factory-ready — aging and unit-level test flows mirror the module lines; 2-year warranty from the first unit.
Enrollment that fits a desk, not a cabinet.
School and campus ID programs need to enroll hundreds of students in a week without IT overhead. An AS618-driven USB collector or padlock-style reader keeps the whole enrollment stack inside a single peripheral:
- 1:1 badge pairing and 1:N lookup on the same chip — no cloud dependency for core identity.
- USB and UART variants let one firmware serve a desktop enroler and an in-door unit.
- SDK threshold tuning lets integrators match the campus policy on FAR/FRR without new silicon.
Also in this line
AS608
Family flagship — 5th-gen fingerprint security SoC, SPI/UART/USB.
AS578
Algorithm-heavy mid-tier performer for industrial access builds.
AS569
Financial-grade crypto coprocessor — TDES/AES/RSA plus fingerprint engine.
AM160-YYH860
⌀16 mm module, 1,000 templates, −40~85°C, 0.3 s — the module it enables.
AS618 FAQs
Yes — 1 pc is the MOQ, and samples ship in 1–3 days with the free SDK, datasheet and demo board guidance.
Both run the in-house algorithm; AS618 is engineered toward slim-profile, power-conscious module builds, while AS608 carries the wider interface set for terminal-class designs.
BS-series capacitive arrays — BS807, BS817, BS870A, BS900T are the reference set; the FAE team matches your sensor model within 48h.
Let an engineer check your slim-module stack.
Send your enclosure sketch or BOM draft — get a footprint clearance, updated datasheet and sample offer within 48h.
