Two markets behind one door.
In 2025 face recognition overtook fingerprint in smart-lock modules — 10.82 M face units (54.6%) vs 6.79 M fingerprint (34.3%) of about 19.8 M modules, with biometric adoption at 72% of new locks. Whatever your road map says, we have the module already running.
Three pressures that decide a lock program.
- Fashion cycles: 3D structured-light face module shipments grew 41% year over year — a lock generation is now about 12 months, and one bad module choice eats two.
- Fake-finger exposure: photo and latex attacks on old optical modules drive returns; dual-lens IR liveness is the new minimum for mid-grade and up.
- Power budget: battery-powered locks measure standby in μA — module choice decides whether the lock survives a winter on four cells.
- Space: BFC388 lands at about 60×20 mm; the AM160 ring module mounts at ⌀14–16 mm. Enclosure geometry stays your design, not the module’s.
What a 2026 lock program needs
| Requirement | Reference target | Our lines |
|---|---|---|
| Face recognition | <0.3 s, 1:1 and 1:N, 0.3–1.9 m distance class | BFC388 / BFC800 / BFP3A2 |
| Liveness | Dual-lens RGB+IR, fake-face rejection >98% class | All face modules above |
| Fingerprint | 0.3 s match, 100–1,000 templates, dry & aged skin | AM160 series, BS-arrays, AS608 SoC |
| Environment | −40~85°C working class, outdoor UV-tolerant housing, IP-grade gasket walls | AM160 metal-ring variants |
| Power | Standby ≤10 μA class, single Li-cell tolerant | AM160 L-variants (low-power) |
| Integration | UART / USB 2.0, free SDK with demo routine, 2-week layout clearance | All modules — 48h FAE |
A face-first BOM that still keeps a fingerprint path.
- BFC388 face module (dual cam, <0.3 s, FAR <0.001%) + AM160 fingerprint module for the back-up key path — one vendor, one SDK dialect.
- AS608 SoC class logic for the lock controller; AS569 crypto coprocessor for key handling — 1,000-template fingerprint engine plus TDES/AES/RSA.
- Free SDK means multiple sensing modes in one UI, and the 48h FAE line handles your seasonal model swaps.
- MOQ 1 pc: validate the exact module before committing a mold.
What integrators report after switching.
Lock OEMs consolidate face and fingerprint modules under one SDK dialect — a single firmware track instead of two vendor stacks, and one FAE contact for both verification channels.
Pattern · Smart lock OEMs — China & Southeast Asia
1 pc MOQ de-risks programs: integrators validate liveness on the real enclosure before the mold order, cutting the sample-to-shelf cycle toward six weeks in repeated engagements.
Pattern · Small-batch integrators — EU importers
Winter-gate performance is where modules separate: −40°C aging exposure prompts gasket-level fixes, and a same-day FAE response keeps the lock program on schedule.
Pattern · Hardware distributors — Central Europe
Pick the module, keep the mold.
Send your enclosure drawing or BOM — we return a module match, updated SDK links and a sample offer within 48h.
