AS608
A single-chip fingerprint security SoC — in-house matching algorithm on national-standard secure execution, built for door locks, attendance devices and financial terminals. Ships with a free SDK, demo routine and 48h FAE access.
Key specifications
| Function | Fingerprint enrollment, 1:1 and 1:N verification on-chip |
|---|---|
| Algorithm | In-house DSP-based matching algorithm — company rejection rate 99.99% verified in lab |
| Sensor interface | Capacitive semiconductor fingerprint arrays (BS-series compatible) |
| Host interfaces | SPI, UART, USB — SDK examples for all three |
| Security features | Secure storage for template data; compatible with dedicated encryption co-processors (AS569) |
| Target applications | Smart locks, time attendance, financial terminals, access controllers |
| Marking | AS608 (5th generation, black QFN-class package) |
Full specification
| Parameter | Value | Note |
|---|---|---|
| Product family | AS-series fingerprint secure SoC | 5th generation performer |
| Algorithm engine | DSP-based, in-house | 400+ registered IP across group |
| Template capacity | Typical lock platform: 200+ templates | Configurable via SDK |
| Match latency (1:N) | Sub-second class | SDK-tuned per platform |
| Interfaces | SPI / UART / USB | All documented in SDK |
| Sensor support | BS-series capacitive arrays | 508 DPI-class |
| Operating environment | Industrial temperature-class design | See AM-series module for full −40~85°C fixture |
| Fake-finger defense | Company 99.99% rejection rate claim, lab-verified | Liveness checks available on module platforms |
| Packaging | Surface-mount, tape/reel on request | ESD-safe handling documented |
Board-level values vary with sensor and clock config — the FAE bench confirms your clock tree within 48h.
One chip, one 4-layer board.
Door-lock OEMs in the smart lock segment shipped over 45 M units in 2025, with China holding about 55% of global output. The AS608 platform was built for exactly this class of product:
- Payload of identity — fingerprint runs on-chip, templates stay in secure storage; pairing with an AS569 crypto coprocessor covers encryption and payment-class use.
- Fast bring-up — SDK examples for SPI/UART/USB mean a working demo in a day, not a month.
- Factory-ready — 24h aging flows and unit-level test pass mirror the module lines; 2-year warranty from first unit.
Attendance, but auditable.
Buddy punching affects about 75% of US employers and costs 3–5% of payroll for a typical 50-person firm. Terminal integrators use AS608 with BS-array sensors to build tamper-evident, template-local identity:
- 1:1 and 1:N modes on a single chip — no cloud dependency for core identity.
- SDK lets you tune thresholds to your market's FAR/FRR target without cost of new silicon.
- Same interface as AM-series modules — scale to a standard product line in one roadmap.
Also in this line
AS618
Fingerprint module companion SoC for slim module designs.
AS569
Financial-grade crypto coprocessor — TDES/AES/RSA, 1,000-match fingerprint engine.
AM160-YYH860
⌀16 mm fingerprint module, 1,000 templates, −40~85°C, 0.3 s.
AM501 Collector
508 DPI USB 2.0 enrollment collector for kiosk and desk setups.
AS608 FAQs
Yes — 1 pc is the MOQ. Samples ship in 1–3 days with a free SDK, datasheet and demo board guidance.
The in-house algorithm is part of the chip; the SDK and its demo routines are free. Merging your own biometric logic onto the platform is a documented, supported workflow.
BS-series capacitive arrays (BS807, BS817, BS870A, BS900T) are the reference set; the FAE team will match your sensor model within 48h.
Let an engineer verify your AS608 design.
Send your schematic notes or target product — get a model matrix, updated datasheet and sample offer within 48h.
