BS817
BS817 is a fingerprint sensor array in the BS family — a 208×288 array class at 500+ DPI — sized for lock modules, where the sensor is the most expensive trade-off on the board. One piece is the MOQ; the free SDK and 48h FAE response cover schematic-level pairing on day one.
Key specifications
| Function | Fingerprint capture, enrollment and 1:1 / 1:N verification through the BS-series controller (family class) |
|---|---|
| Sensor type | Active-capacitive semiconductor fingerprint array |
| Array class | 208×288 — lock-module workhorse of the family |
| Resolution | 500+ DPI |
| Integration depth | Slim package mates to lock bodies; exact height on datasheet request |
| Target applications | Smart lock modules, campus door controllers, apartment access |
| Marking | BS817 (208×288, 500+ DPI array) |
Full specification
| Parameter | Value | Note |
|---|---|---|
| Product family | BS-series semiconductor fingerprint sensor | 500+ DPI class |
| Array class | 208×288 | Family standard mid format |
| Sensor resolution | 500+ DPI | Lock-grade detail at module cost |
| Interface | BS-series controller; host side UART | Family class SDK routing |
| Match speed | <0.3 s on AM160-class controller | Family class |
| Template capacity | 200–1,000 at controller level | Family class, SDK-configurable |
| Operating environment | Module-level −40~85°C | Family class (AM-series fixture) |
| Fake-finger defense | Capacitance-liveness at controller | Family class |
| Packaging | Tape/reel or tray | On request, ESD-safe handling |
Array capacitance and optical stack are matched per module design — the FAE team validates your touchpad stack-up within 48h.
One sensor, one dorm floor.
Smart-lock OEMs shipped over 45 M units in 2025, with China holding about 55% of global output — and campus housing is the front edge of that wave. A BS817-based module turns a single dorm door into a managed credential point:
- Floor-level scale-up — controller-side capacity in the 200–1,000 template class covers a residence floor without a second board (family class).
- Rotation without re-enrollment — templates ship between locks through the SDK's 1:1 export format, so room moves cost nothing at the door.
- Programming-safe upgrade — the same BS-series interface family as the module hub, so one firmware branch serves the campus roll.
Where the 70% is made.
Fingerprint chips for lock modules hold about 70% of China's smart-lock segment per domestic industry estimates — this is the sensor line that serves that volume. BS817-family units run through 24h aging flows, burn-in checks and unit-level test pass before packing.
- Volume supply is 10–25 days for orders under 5,000 units; 1 pc ships in 1–3 days for pilots.
- Free SDK covers enrollment, liveness hooks and threshold tuning for FAR/FRR targets.
- Samples carry the 2-year warranty — same terms as production replenishment.
BS817 FAQs
Yes — order 1 pc, and the FAE team will pre-check your module schematic within 48h so the breadboard is right the first time.
The algorithm ships with the sensor-family SDK free of charge, including enrollment and threshold-tuning routines for lock use.
Module-level rating is the −40~85°C family class, with dry-finger handling via capacitance-liveness at the controller; the FAE team sizes your door-side stack-up.
Start your lock module with one sensor.
Stake a 208×288 layout, get the controller pairing, SDK drop and 1-pc sample offer — all inside the 48h FAE slot.
